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Research and Development Trends of China IC (Integrated Circuit) Packaging and Testing Industry, 2013

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Research and Development Trends of China IC (Integrated Circuit) Packaging and Testing Industry, 2013

  • 【报告编号】: 523269
  • 【最新修订】: 2013年07月30日
  • 【关 键 字】: IC (Integrated Circuit) Packaging and Testing
  • 【报告页数】: 52
  • 【报告格式】: 电子版或纸介版
  • 【交付方式】: Email发送或EMS快递
  • 【价    格】: 纸介版:$1750    电子版:$1550
  • 【订购热线】: 010-51263229    010-51265563
报告导读:

报告目录

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Research and Development Trends of China IC (Integrated Circuit) Packaging and Testing Industry, 2013

1. Overview of IC Packaging and Testing 
1.1 Definition of IC Packaging and Testing Industry 
1.2 Industrial Chain of IC Packaging and Testing Industry
1.3 Industrial Environment of China’s IC Packaging and Testing Industry

2. Development Overview of the Global IC Packaging and Testing Industry
2.1 Status Quo 
2.2 Comparison of Industrial Policies in Developed Countries and Regions 
2.2.1 The US: Driving by the National Defense 
2.2.2 Japan:Application of the Industry and Consumption Fields 
2.2.3 South Korea:Being Government-Lead 
2.2.4 India: Protection of the Intellectual Property Rights 
2.2.5 Taiwan of China: Capital Support 

3. Development Overview of China’s IC Packaging and Testing Industry
3.1 Development Status Quo
3.2 Main Existing Problems 
3.3 Indigenous Enterprises Rise

4. Market Development of China’s IC Packaging and Testing 
4.1 China’s IC Packaging and Testing Dominating the Half Market 
4.2 Innovative Capability Being Gradually Strengthened of the Domestic Packaging and Testing Industry 
4.3 Distribution and Production Capacity of Domestic IC Packaging and Testing Manufacturers 
4.4 Competitive Pattern of Domestic Packaging and Testing Industry 

5. Major Enterprises of China’s IC Packaging and Testing Industry
5.1 ASE Group 
5.1.1 Company Profile 
5.1.2 Operation 
5.1.3 Development Strategy 
5.2 Siliconware Precision Industries Co., Ltd.
5.2.1 Company Profile 
5.2.2 Operation 
5.2.3 Competitiveness 
5.2.4 Research and Development 
5.2.5 Operation Goals and Development Strategy, 2013 
5.3 STATS ChipPAC Ltd. 
5.3.1 Company Profile 
5.3.2 Operation 
5.4 KYEC
5.4.1 Company Profile 
5.4.2 Operation 
5.4.3 Future R & D Orientation 
5.4.4 Development Strategy 
5.5 Jiangsu Changjiang Electronics Technology Co., Ltd.
5.5.1 Company Profile 
5.5.2 Operation 
5.5.3 Competitiveness
5.5.4 Development Strategy
5.6 Nantong Fujitsu Microelectronics Co., Ltd. 
5.6.1 Company Profile 
5.6.2 Operation 
5.6.3 Competitiveness
5.6.4 Business Goals, 2013 
5.7 Tianshui Hutian Technology Co., Ltd. 
5.7.1 Company Profile 
5.7.2 Operation 
5.7.3 Competitiveness
5.7.4 Development Strategy
5.7.5 Development Goals 

6. Future Development of China’s IC Packaging and Testing Industry
6.1 Development Trends 
6.2 Challenges and Opportunities 
6.3 Experts’ Suggestions on Development 
6.3.1 Intensifying the Corporate Innovative Capability 
6.3.2 Strengthening the Investment and Financing Support 

报告描述

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Research and Development Trends of China IC (Integrated Circuit) Packaging and Testing Industry, 2013 firstly analyzes the development of the global IC packaging and testing industry, as well as making the comparison against the differences between China’s and other major counties’ related industrial policy in the world. Secondly, it makes in-depth analysis of the overview, market pattern and other aspects of China’s IC packaging and testing industry; finally it makes the professional analysis of the future development of China’s IC packaging and testing industry as well as putting forward the suggestions, which can offer the decisive references for the investment in the field.

In 2012, the sales revenue scale of China’s packaging and testing industry was CNY 103.567 billion, increasing 6.1% year-on-year and accounting for 47.98% of the sales revenue of the IC industry. In the first quarter of 2013, the sales revenue of the packaging and testing industry was CNY 23.12 billion increasing 5.9% year-on-year and accounting for 44.6% of the sales revenue of the IC industry.

At present, for the enterprises of the domestic IC packaging and testing industry, the three-pillar pattern of the foreign-ventured enterprises, joint-ventured enterprises and domestic-funded enterprises has been formed. Among them, for the packaging and testing factories funded by the major international semiconductor enterprises such as Freescale, Intel, Matsushita, Fujitsu, STMicroelectronics, Renesas and Infineon, whether in the scale or in the technical levels, they have the leading position. In 2012, the foreign-ventured enterprises and joint-ventured enterprises have showed the transferring trend of the packaging orders and capacity to the inland. For recent years, Tianshui Huatian Technology Co., Ltd., the domestic enterprise, has continuously intensified the technology R & D and got the obvious progress in the packaging technology. In the future, with the continuous improvement of the domestic enterprises’ technology and management levels, the market competitiveness of the domestic enterprises will be further improved; in the meantime, with the continuous development of the IC packaging technology and continuous changes of the demand for the whole machine electronic products, the competitive of the domestic enterprises will be much fiercer in technology, market, quality, cost and other aspects.

But in the meantime, with the transferring of the global IC packaging and testing business to China mainland industry as well as the policy support, the packaging and testing enterprises of China mainland are provided an absolutely excellent opportunity to catch and exceed the world first-class semiconductor enterprises. As the technical progress is accelerated and the cost pressure is intensified, the competitive pattern of the IC packaging and testing enterprises has evolved into the comprehensive competition focusing on the quality, technology, cost and service from the past one that focusing on the quality and technology.
 

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